Optimizing Flip Chip Substrate Layout for Assembly
High-density flip chip applications are commonly limited by the available substrate technologies. Accordingly, considerable design efforts are focussed on the optimized routing of signal, power and ground connections. More often overlooked are some of the effects of the substrate surface layout on assembly yields.
The first person who can tell me what any of that means wins something. Probably just the derisive sneers of your peers and loved ones, but that qualifies as "something," right?